The AXI-E600 is a new-generation ultra-high precision 2D/2.5D inspection system, specifically designed for advanced semiconductor packaging and microelectronic components. Leveraging nanometer-level focusing technology and an ultra-high-resolution detector, it achieves resolution capabilities of up to 1μm, addressing stringent inspection requirements for Wire Bonding, Die Bonding, and Flip Chip applications. Automated 2D X-Ray inspection can reduce manual intervention and ensure consistent, repeatable results across high-volume production lines, making it an indispensable tool for precision-driven semiconductor packaging facilities.
Nanometer-Level Resolution
Reach 1μm ultra-high resolution imaging for precision inspection of micro-scale structures
Automatically identifies complex defects including cold solder joints, wire breaks, and package delamination.
Enables seamless integration with AOI/SPI equipment to establish end-to-end intelligent inspection workflows.
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49.5μm |
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2352x2944 |
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20fps |
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116.5x145.5 |
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X-Ray Tube |
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40-110kV |
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100-200μA |
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1μm |
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Max. Power |
16W |
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Max. Load Size(mm) |
600x570 |
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Max. Inspection Size(mm) |
510x510 |
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MAX 10kg |
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X/Y/Z1/Z2 Motion(mm) |
510/510/200/150 |
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1300x1450x1650(WxDxH) |
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1600kg |
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220AC/50HZ |
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2kW |
After-sales Service
We offer 24/7 hotline and online technical support. In the event of equipment malfunctions, our engineers will respond within 1 hour and provide solutions within 24 hours (specific commitments subject to regional availability).
Comprehensive original factory warranty services are provided. Upon expiration of the warranty period, customers shall bear the relevant costs for spare parts replacement and maintenance.
We continuously deliver functional upgrade services for equipment software and commit to providing long-term technical and lifecycle support for sold equipment.
Rich experience in the R&D of core hardware and software technologies for CT systems.
Our team has long been dedicated to the R&D of core hardware and software technologies for CT systems, while advancing the application of artificial intelligence (AI) in industrial sectors. Focusing on high-value precision non-destructive testing (NDT) using X-ray technology in the pan-semiconductor industry, we have independently developed an industrial CT 3D reconstruction and intelligent inspection hardware-software platform, and launched standardized inline 3D AXI products. Serving industrial fields, including electronic circuits, pan-semiconductors, and consumer electronics, Empowering enterprises to address non-destructive inspection challenges in high-speed production line.
Priljubljena oznake: automated 2d x-ray inspection, China automated 2d x-ray inspection manufacturers, suppliers, factory